By James J. Licari
"I suggest this booklet with out reservation to each person in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley
, Pages vii-viii
, Pages ix-x
1 - Introduction
, Pages 1-37
2 - services and idea of Adhesives
, Pages 39-94
3 - Chemistry, formula, and houses of Adhesives
, Pages 95-168
4 - Adhesive Bonding Processes
, Pages 169-260
5 - Applications
, Pages 261-346
6 - Reliability
, Pages 347-391
7 - try and Inspection Methods
, Pages 393-430
, Pages 431-439
, Pages 441-457
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Additional info for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability
1] The degree of polymerization or completeness of cure may also be measured by infrared spectroscopy by the amount of reduction of absorption of specific groups as they are converted by crosslinking through addition or condensation polymerization. 1.  The change in the epoxy absorption band of diglycidylether of bisphenol A (DGEBA) resin as it reacts with a primary aliphatic amine at room temperature is shown in Fig. 2. The ability of an adhesive to form a strong bond between different surfaces depends on its ability to wet the surfaces, its flow or rheology properties, and the nature of the bonding mechanism.
Harper, C. , and Sampson, R. � Lau, J. � Wong, C. , Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding, HewlettPackard J. (Aug. , Chip-Scale Packaging Meets Future Design Needs, Solid State Technol. (Apr. � Bauer, C. , Lets Talk Chip Scale, Circuits Assembly, IPC Supplement (Apr. � Ngulty, T. , and Ekere, N. , Chip Scale vs Flip Chip: Issues to Consider, Circuits Assembly (Nov. � Schueller, R. , pp. 9194 (Feb. , Advantages of System on a Package and System on a Chip, Electronic Packaging and Production (Jul.
Adhesives for flex circuits must meet several requirements, some of which are as follows: � Retain adhesion while the circuit is flexed � Wet and bond well to both the polymer film and the copper foil � Have low moisture absorption � Have good dielectric properties � Have low or no-flow characteristics Be thermally resistant to solder-reflow temperatures As with PWBs, flex-circuits may be single layer, double sided, or multilayer. ��������������������Chip-on-flex is similar to chip-on-board except that the die, chips, or CSPs are wire bonded, flip-chip attached, or epoxy connected to a flexible circuit instead of to a rigid interconnect substrate such as a PWB.
Adhesives Technology for Electronic Applications. Materials, Processes, Reliability by James J. Licari